MECHANIC ROHS Lead-Free Solder Paste V6B45 138℃ 40g
Description:
The BGA Flux Solder Paste is a high viscosity, no-clean flux, and can be used for PCB, SMD, reworking, and reballing of computer and phone chips. It is a mixture of high-quality alloyed powder and resinic pasty flux. It also doesn't leave pale yellow residue either, making it easy to clean the board.
Repairs circuit boards and protects electronic components making it a necessary material for repairing the mobile phone mainboard.
Doesn't contain lead.