PPD Best Melting Point Lead-Free Solder Paste for A8 A9 A10 A11 - S260 138℃
Description:
This solder paste has a melting point of 138 degrees with an alloy composition of SiBn (Tin and Bismuth). When the components of the fixture can't withstand temperatures above 138℃, the solder paste is welded with the solder paste to protect against high temperatures.
Volume: 50g
Temperature: 138℃ (S260)
It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary tool in BGA reballing.
Feature :
- Excellent capacity of solder-stickiness
- Excellent Anti-wet Capacity
- Widely used on BGA, PGA, CSP packages and flip chip operation
- Suitable for multiple PCB reflow
- Easy to clean and lead free for environmental protection
